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Numerical approach to cold gas spray on ceramic substrates for power electronics packaging
(2018-11-29)
Power electronics packaging plays a key role in the translation from robust mechanical systems, to more efficient electronic systems. One of the current power modules chal- lenges is the direct bond copper process used to ...
Characterization and redesign of rubber-to-metal molded vascular clamp inserts
(2018-12-03)
This work is a first step into the characterization of the rubber-to-metal bonded components in vascular clamp applications. Using ASTM standards, test methods were modified, developed, and implemented to perform ...
Assessment of a Au-Sn transient liquid die attach for harsh environments electronics
(2018-05)
The constant development of new technologies in the area of power electronics requires new interconnection materials capable of resisting high temperature environments for wide-bandgap semiconductors such as SiC. Die attach ...