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A numerical and experimental comparative study on the performance of organic and metallic phase change materials under high power millisecond pulses
(2017-05)
Phase changes materials (PCMs) have been studied as passive cooling alternative for different conditions. Due to the US Army need for the development of a passive cooling system alternative for pulsed power applications, ...
Stability of silver colloid by process control of the synthesis using design of experiments
(2013)
Extensive resources have been utilized to develop SiC (silicon carbide) semiconductor devices, there has been relatively little effort into the development of adequate, environmentally benign electronic packaging materials ...
Metallic phase change materials (mPCMs) stability and compatibility analysis under repetitive melting/solidification cycles
(2020-07-24)
Metallic phase change materials (mPCMs) have been demonstrated as a
potential passive cooling solution for pulse power applications. The possibility of
integrating a metallic PCM directly on top of a heat source, reducing ...
Structural transformations of low temperature, pressureless sintered silver nanoparticles for die attach interconnections
(2012)
The new generation of wide-bandgap semiconductor devices has proved superb performance among high power electronic devices, demonstrating total functionality at temperatures above 500°C. However, they are limited by current ...
High temperature die attach by low temperature gold-tin solid-liquid interdiffusion
(2012)
There is a need for electromechanical devices capable of operating in high temperature environments (>200°C) for a wide variety of applications. Today’s widebandgap semiconductor based power electronics have demonstrated ...
Numerical approach to cold gas spray on ceramic substrates for power electronics packaging
(2018-11-29)
Power electronics packaging plays a key role in the translation from robust mechanical systems, to more efficient electronic systems. One of the current power modules chal- lenges is the direct bond copper process used to ...
PB-free electronics: from nanotechnology to combinatorial materials science
(2013)
The elimination of lead (Pb) from the electronics industry due to a government directive caused problems on the manufacturing and use of electronic components. The current alloys used to attach components have a significant ...
Characterization and redesign of rubber-to-metal molded vascular clamp inserts
(2018-12-03)
This work is a first step into the characterization of the rubber-to-metal bonded components in vascular clamp applications. Using ASTM standards, test methods were modified, developed, and implemented to perform ...
Assessment of a Au-Sn transient liquid die attach for harsh environments electronics
(2018-05)
The constant development of new technologies in the area of power electronics requires new interconnection materials capable of resisting high temperature environments for wide-bandgap semiconductors such as SiC. Die attach ...