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Structural transformations of low temperature, pressureless sintered silver nanoparticles for die attach interconnections
(2012)
The new generation of wide-bandgap semiconductor devices has proved superb performance among high power electronic devices, demonstrating total functionality at temperatures above 500°C. However, they are limited by current ...
PB-free electronics: from nanotechnology to combinatorial materials science
(2013)
The elimination of lead (Pb) from the electronics industry due to a government directive caused problems on the manufacturing and use of electronic components. The current alloys used to attach components have a significant ...