Now showing items 1-4 of 4
Template assisted manufacturing of low-temperature copper-based nano solder
As a response to new legislation and calls to lead-free technologies, a method is proposed to manufacture nano-copper by means of electroless copper plating on nanofibers templates. Polyacrylonitrile (PAN) nanofibers were ...
Structural transformations of low temperature, pressureless sintered silver nanoparticles for die attach interconnections
The new generation of wide-bandgap semiconductor devices has proved superb performance among high power electronic devices, demonstrating total functionality at temperatures above 500°C. However, they are limited by current ...
PB-free electronics: from nanotechnology to combinatorial materials science
The elimination of lead (Pb) from the electronics industry due to a government directive caused problems on the manufacturing and use of electronic components. The current alloys used to attach components have a significant ...
On the selection of commercially available Sn-Ag-Cu Pb-free balls components over re-balling the components with Sn37Pb balls to comply with the restriction of hazardous substances directive in the aerospace industry
A modeling approach based on physics of failure is presented that quantifies the interactions between different thermal cycles applied to Ball Grid Arrays (BGA). The approach is formulated at the microscale, incorporating ...