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Novel separation methods for removing nanoparticles and copper from chemical mechanical planarization wastes
Chemical mechanical planarization (CMP) wastewater emanating from semiconductor processing contains copper (II) ions and either alumina and/or silica nanoparticles. The efficiency of biotreatment schemes to remove copper ...
Effect of engineering iron oxide nanoparticles on effluent water quality from biological wastewater treatment
The production, use, and disposal of products containing nanoparticles may lead to their appearance in air, water, and soil, and subsequently in the human body. Because there is no existing regulation, large amounts of ...