The constant development of new technologies in the area of power electronics requires new interconnection materials capable of resisting high temperature environments for wide-bandgap semiconductors such as SiC. Die attach ...

Phase changes materials (PCMs) have been studied as passive cooling alternative for different conditions. Due to the US Army need for the development of a passive cooling system alternative for pulsed power applications, ...

Extensive resources have been utilized to develop SiC (silicon carbide) semiconductor devices, there has been relatively little effort into the development of adequate, environmentally benign electronic packaging materials ...

There is a need for electromechanical devices capable of operating in high temperature environments (>200°C) for a wide variety of applications. Today’s widebandgap semiconductor based power electronics have demonstrated ...

Power electronics packaging plays a key role in the translation from robust mechanical systems, to more efficient electronic systems. One of the current power modules chal- lenges is the direct bond copper process used to ...

The elimination of lead (Pb) from the electronics industry due to a government directive caused problems on the manufacturing and use of electronic components. The current alloys used to attach components have a significant ...

This work is a first step into the characterization of the rubber-to-metal bonded components in vascular clamp applications. Using ASTM standards, test methods were modified, developed, and implemented to perform ...

Metallic phase change materials (mPCMs) have been demonstrated as a potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing ...

The new generation of wide-bandgap semiconductor devices has proved superb performance among high power electronic devices, demonstrating total functionality at temperatures above 500°C. However, they are limited by current ...